| 摘要 |
PURPOSE:To enhance the hermetic property of a device and thus protect an element from the outside by a method wherein a projection having a hole tapered outward is provided at the electrode penetration part of the cap of a molding case, and unhardened resin is made to creep up to the upper part through the hole by pushing this projection into the unhardened resin. CONSTITUTION:The semiconductor element 8 is mounted on a substrate 9 and then connected to an electrode 4. The molding case 2 consists of a frame body 10 so installed as to surround the element 8 and of the cap 2. And, filling this case with the resin 1 makes the hardening reaction of the resin advance immediately thereafter. The resin 1, when it is in softened state, contrives to seal the case by the cap 2 and at the same time to hermetically seal the gap between the inner hole 5 and the electrode 4 by fixing the cap 2 to the frame body 10 and thus pushing the projection 3 into the inner hole 5, thereby infiltrating the resin 1 into the inner hole 5 of the projection 3. |
