发明名称 TAPING PACKAGING MATERIAL
摘要 PURPOSE:To provide a taping packaging material consisting of a seal tape, which displays an excellent antistatic ability for a long period of time, and an embossed tape, in order to meet the tendency of a high integration of a small sized electronic component such as IC. CONSTITUTION:For a taping packaging material for small sized electronic components, a seal tape is constitued of a four layer structure with a base film layer 11, a heat sealable sealant layer 12 which is formed on the surface on the embossed tape side of the base film layer, a conductive innermost layer 13 including a tetracyanoquinodimethane complex which is formed on the surface of the heat sealable sealant layer, and a conductive outermost layer 14 including the tetracyanoquinodimethane complex which is formed on the other surface of the base film layer.
申请公布号 JPH05201467(A) 申请公布日期 1993.08.10
申请号 JP19920029958 申请日期 1992.01.22
申请人 KORUKOOTO ENG KK 发明人 YAMAGUCHI ISAMU;HOSODA MASAYO
分类号 B65D73/02;B65D85/38;B65D85/86;H05K13/02 主分类号 B65D73/02
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