| 摘要 |
PURPOSE:To reduce glass fiber scraps and resin powder generated from prepreg when a multilayer printed circuit board is manufactured and to reduce the steps of combining the prepregs and a material cost. CONSTITUTION:When constituent materials of a multilayer printed circuit board are superposed through prepreg, heated, and pressurized to be integrated, glass cloth having a thickness of 0.13-0.16mm and a weight of 145-175g/m<2> is used as a base material, one prepreg having 55-65% of resin component is interposed between the materials, heated and pressurized. |
