| 摘要 |
<p>PURPOSE:To provide a solder dipping apparatus for adequately soldering a lead of an SOJ or a surface mounting-type LSI package. CONSTITUTION:In a solder dipping apparatus, a rotary arm 5 with a package holding part 4 is provided above a solder dipping bath 3. After an LSI package 11 with its lead 14 placed upward is held in the package holding part 4, the rotary arm is turned 180 degrees and the lead 14 is dipped and coated with the melted solder 2. Then, the rotary arm 5 is rotated at a high rate so that an extra melted solder 2 is separated from the lead 14 through centrifugal force.</p> |
