| 摘要 |
PURPOSE: To obtain a multilayer circuit board having high heat dissipation characteristic by providing a thermal conductive base part, electric insulating thermal conductive bottom part layer which is essentially arranged on the base part on a surface, and at least two separate layers of a conductive circuit lead line for interconnecting the circuit parts. CONSTITUTION: A multilayer heat dissipation circuit board 40 is provided with a base part board 70, constituted of high thermal conductive materials. The base part board 70 is provided with a bottom part insulating layer 72, constituted of thermal conductive dielectric epoxy for preventing electric contact between the base part board 70 an the upper arranged layer of the circuit. A plurality of alternate layers of conductive strips and selectively arranged interposed insulating layers are positioned on the insulating layer 72, and the prescribed strip in each conductive layer is separated from the strip in another conductive layer by an insulating means. On the other hand, predetermined positions between the conductive strips in the different layers are exposed, so that electric contact can be made. The several conductive strips are formed by using a conductive ink, and the insulating and conductive layers are applied by using a silk screening. |
