| 摘要 |
<p>PURPOSE:To manufacture a highly precise printed wiring board having no oozing, skip and the like and also having improved resisting property and covering property of coated film. CONSTITUTION:The title manufacturing method is a method for manufacture of a solder resist forming printed circuit board having a smoothed surface, and the method comprises a process in which the printed circuit board is coated with the resist ink consisting of at least epoxy resin and ultraviolet-ray curing cationic polymerization catalyst, and another process in which the formed resist film is polished by a belt sander.</p> |
