| 摘要 |
PURPOSE:To reduce the impedance of a conductor for connection and to improve the function of a semiconductor device packaging device by housing a passive element and a wiring substrate within a container, at the same time packaging a conductive plate body for mounting the passive element and wiring substrate within the container, and connecting the terminal for grounding the semiconductor device to a conductive layer for grounding. CONSTITUTION:A passive element 2 and a wiring substrate 3 are housed within a container 5, at the same time a conductive plate body 4 for mounting the passive element and wiring substrate is packaged within the parts 5 for connecting a terminal TG for ground connection of a semiconductor device 1 to a conductor layer G for grounding the container 5. Therefore, at the time of packaging, the conductive late body 4 for mounting the passive element and wiring substrate can be placed closer to the semiconductor device 1 easily and the gaps among the semiconductor device 1, the passive element 2, and the wiring substrate 3 can be reduced drastically, thus enabling impedance to be low and the function as the semiconductor device packaging device to be superb. |
