| 摘要 |
<p>PURPOSE:To prevent the interface exfoliation between an end surface destruction protective layer and a sealing resin layer which exfoliation is to be caused by heat cycle in a mold type semiconductor laser device wherein cost is low and shape is free, and realize a device of long life. CONSTITUTION:A sticking layer 21 having large adhesion to a sealing resin layer 30 is formed, by irradiating the radiation surface 11 side of an end surface destruction protective layer 20 with ultraviolet radiation. Thereby interface exfoliation due to the stress generated by heat cycle is restrained, so that a semiconductor laser device of long life wherein laser light characteristics are stable can be realized.</p> |
