| 摘要 |
<p>PURPOSE:To reduce warps with a difference in coefficient of thermal expansion between the product plate zone and the waste plate zone by forming a dummy inner layer circuit pattern of a remaining proportion of copper foil almost equal to that of the inner layer circuit pattern of the product plate zone in the inner layer substrate of the waste plate zone and by removing the waste plate zone along a folding break line after inner/outer substrates are stacked. CONSTITUTION:A multilayered board 10 has a product plate zone 22 serving as a multilayered printed wiring board and a waste plate zone 24 surrounding this product plate zone 22. In each inner layer substrate, an inner layer circuit pattern 16 is formed in a range included by the product plate zone 22, and a dummy inner layer circuit pattern 16A in the waste plate zone 24 as well. The inner layer circuit pattern 16A is so designed as to show a remaining proportion of copper foil almost equal to that of the inner layer circuit pattern. Thus, after an inner layer substrate forming inner layer circuit patterns 16, 16A in the product plate zone 22 and the waste plate zone 24 is stacked on an outer layer substrate, a folding break line 26 is formed to complete a laminated board 10. Folding along a folding break line 26 after components are mounted can provide a product plate zone 12.</p> |
