| 摘要 |
PURPOSE: To solve the problem of corrosion of an input/output bonding pad formed by a method, wherein a protective layer is provided on the input/output bonding pad and is protected from harmful corrosive action. CONSTITUTION: A plurality of electric conductive via holes 34 extending to the surface of a substrate 32, a multilayer metal input/output pad 46, which is electrically connected at least to a via hole 34, and a soldering fillet are provided. The method, which protects an input/output pin 42, which is soldered to the input/output pad, and the ceramic substrate 32, includes the step which completely encupsulates the input/output pad by a polymer material protective layer 48 which protects the input/output pad 40 from corrosion. |
