发明名称 METHOD OF PLANARIZING METAL LAYER
摘要 A planarization method includes the steps of forming a second layer (4) on a first layer (1) which has an alignment mark (3B) having a heat sink structure, where the second layer is made of a metal, and irradiating a pulse energy beam on the entire exposed surface of the second layer (4) to planarize the second layer. The heat generated in the second layer (4) on the alignment mark (3B) is released via the first layer (1) so that substantially no melting of the second layer occurs on the alignment mark. <IMAGE>
申请公布号 EP0448471(A3) 申请公布日期 1993.05.26
申请号 EP19910400759 申请日期 1991.03.20
申请人 FUJITSU LIMITED 发明人 MUKAI, RYOICHI
分类号 H01L21/3205;H01L21/268;H01L21/321;H01L21/768;H01L23/544;(IPC1-7):H01L21/90 主分类号 H01L21/3205
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