| 摘要 |
PURPOSE:To automatically form the coordinates of a wire bonding position. CONSTITUTION:A pad graphic is formed by extracting scribed lines and pads from semiconductor integrated circuit designing data designed by a CAD for a semiconductor integrated circuit and converted into a format to be processed by a lead-frame CAD and the converted format is outputted to the lead frame CAD. The lead frame CAD forms a lead graphic by extracting lead pins from existing lead frame designing data, compares the pad graphic with the lead graphic, and when both the graphics are matched with each other, combines lead side bonding position coordinates on respective lead pins of the lead frame corresponding to the lead graphic and the pad position coordinates of respective pads to obtain wire bonding position coordinates and converts the wire bonding position coordinates into a format to be processed by a wire bonder to output the converted format. |
