| 摘要 |
<p>A two-layer or multilayer printed circuit board (1) comprises a support plate (2) carrying a first conductor pattern (3) and a second conductor pattern (21) which is connected to said support plate (2) via an adhesive layer (13) consisting of adhesive material, a solder-stop layer (30) being applied to said second conductor pattern. A hole (14, 15) is formed in the adhesive layer (13), via which hole a solder section (4, 5) of the first conductor pattern (3) can be electrically connected to a solder section (22, 23) of the second conductor pattern (21) via a soldered joint (37, 38), a further hole (31, 32) being formed in the solder-stop layer (30), which hole communicates with the hole (14, 15) in the adhesive layer (13), the cross-sectional area of said further hole being divisible in two areas of equal shape and equal surface content, one of said areas being coincident with the cross-sectional area of the hole (14, 15) in the adhesive layer (13) and the other area being situated completely inside a closed area of the solder section (22, 23) of the second conductor pattern (21). <IMAGE></p> |
