Heat transfer body for cooling of semiconductor component - has ribs upstanding from base to grip prongs of component which are forced into corresp. grooves

摘要

The grooves (2) in the base (1) of the body have a rounded U section with an opening for insertion of individual components (3) having two prongs (4) which become bent so that each component is gripped between two ribs (5a, 5b). The length (L) of the prong (4) in contact with the rib (5) is between 60 and 80% of the circumference (U) of the grooves (2), whose opening (W) is at least equal to the width (B) of the prong. ADVANTAGE - A firm connection affording max. heat transfer surface between the base and individual components is achievable without recourse to special tools.