发明名称 METHOD FOR SHEATHING ELECTRONIC PART
摘要 PURPOSE:To automatically load a printed circuit board with an electronic part by an automatic chip presser by packaging the electronic part. CONSTITUTION:In sheathing the surface of an electronic part 1 with a resin 4, pressing force is applied to a part of the surface of the resin 4 applied to the surface of the electronic part 1 when the resin 4 applied to the surface of the electronic part 1 is yet in a softened state on the way to the cured state of the resin 4.
申请公布号 JPH05104551(A) 申请公布日期 1993.04.27
申请号 JP19910266037 申请日期 1991.10.15
申请人 MURATA MFG CO LTD 发明人 YONEZAWA MASAO;MATSUMURA SEIICHI
分类号 B29C43/18;B29C43/32;B29L31/34;H05K3/28 主分类号 B29C43/18
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