发明名称 |
METHOD FOR SHEATHING ELECTRONIC PART |
摘要 |
PURPOSE:To automatically load a printed circuit board with an electronic part by an automatic chip presser by packaging the electronic part. CONSTITUTION:In sheathing the surface of an electronic part 1 with a resin 4, pressing force is applied to a part of the surface of the resin 4 applied to the surface of the electronic part 1 when the resin 4 applied to the surface of the electronic part 1 is yet in a softened state on the way to the cured state of the resin 4. |
申请公布号 |
JPH05104551(A) |
申请公布日期 |
1993.04.27 |
申请号 |
JP19910266037 |
申请日期 |
1991.10.15 |
申请人 |
MURATA MFG CO LTD |
发明人 |
YONEZAWA MASAO;MATSUMURA SEIICHI |
分类号 |
B29C43/18;B29C43/32;B29L31/34;H05K3/28 |
主分类号 |
B29C43/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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