| 摘要 |
<p>PURPOSE:To provide an alignment method which makes the alignment of a plurality of chips to be mounted with a wiring board completed at once of alignment step in a method for manufacturing a semiconductor device having a structure that chip electrodes and bump electrodes of a wiring board are connected face to face. CONSTITUTION:A mask 8 is prepared which has openings of the same shape as that of chips 7 at points corresponding to chip mount positions on a wiring board 4, where a chip 7 mounted in this opening 7 is set with electrodes 6 faced up and set in the direction where bump electrodes 5 of the wiring board 4 are made to face from above them, resulting in alignment of both electrodes. Thereafter, aligned chips 7 and wiring boards 4 are put into a hermetic bag and sealed in a vacuum state, and this bag is opened after chip rears are turned up to be followed by the bonding step that is a next step.</p> |
