发明名称 FLEXIBLE MATRIX CIRCUIT BOARD AND DISPLAY BOARD
摘要 PURPOSE:To speedily radiate heat generated by electric components and a metallic conductor circuit by wiring thin and flexible metallic conductors in three dimensions and in various mesh shapes while insulating them in advance. CONSTITUTION:The metallic conductors of <=0.2mm in diameter while previously insulated are wired in three dimensions and in at least a crossing mesh shape and desired insulation parts are removed to expose the metallic conductors, constituting the flexible matrix circuit board. Further, a function component is constituted having a matrix circuit constituted by mounting the electric components such as a diode and a resistance element on the matrix circuit board. Gaps between, for example, plane woven mesh three-dimensional electric conductors 2 are impregnated with an insulating agent 3 to form a circuit board and on the plane of an insulating coating metal conductors wired in three dimensions and in the mesh shape, an insulation part of the electric conductors 4 and 5, exposed on the surface, where the electronic components, etc., are mounted is polished to expose the metallic conductors; and the electric conductor 4 is provided with a monochromatic light emission diode chip 6, the electric conductor 5 is provided with a bonding wire 8, and they are connected by a wire 7 to constitute the display board.
申请公布号 JPH0572978(A) 申请公布日期 1993.03.26
申请号 JP19910262591 申请日期 1991.09.17
申请人 DENKI KAGAKU KOGYO KK 发明人 SAWA HIROAKI;YOKOYAMA YOSHIHIRO;KATO KAZUO
分类号 G09F9/33;H01L23/12;H01L33/64;H05K3/46 主分类号 G09F9/33
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