发明名称 INSPECTION OF MULTILAYER PRINTED WIRING BOARD
摘要 PURPOSE:To lessen delay of delivery and reduce increase of failure expenses due to reproduction by finding an arrangement error of a multilayer printed wiring board on each internal layer layer face at an early stage. CONSTITUTION:On a printed wiring board 1 provided with clearance holes at corresponding positions previously on each of internal layer layer fades, hole drilling is carried out while continuously measuring torque and z-axial moving amount of a spindle motor 8. It is possible to find an arrangement error of an internal layer at an early stage by continuously measuring variation of torque of the spindle motor 8, and accordingly, it is possible to lessen delay of delivery and reduce increase of failure expenses due to reproduction.
申请公布号 JPH0538610(A) 申请公布日期 1993.02.19
申请号 JP19910196358 申请日期 1991.08.06
申请人 NEC CORP 发明人 SUZUKI TOSHIYA
分类号 B23B35/00;B23B41/00;G01L5/00;G01N3/00;G01N3/58;G01R31/28;H05K3/00;H05K3/46 主分类号 B23B35/00
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