| 摘要 |
A closed-cycle expansion-valve impingement cooling system provides cooling for electronic components that have a high-density heat flux. Coolant passes from a compressor to a supply heat exchanger where its temperature is reduced and from there to an impingement plenum of a cooling chamber. Expanded cooling medium, at substantially reduced temperature, directly impinges on the electronic components to be cooled, thereby removing heat from the components. The heated coolant then returns to the compressor through a return heat exchanger. The cooling medium may be air or may undergo a phase change at the surface of the components, thereby improving the efficiency of heat removal.
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