发明名称 |
Technique for preparing a photo-mask for imaging three-dimensional objects |
摘要 |
A method for the preparation a photo-mask used for photo-imaging selected areas on the surfaces of a three-dimensional printed circuit board substrate. The photo-mask comprises an opaque layer, opaque and degradation resistant to UV light, having at least one side with a contoured shape conforming to the surface irregularities on the surfaces of the three-dimensional substrate being photo-imaged. A membrane transparent and degradation resistant to UV light, having at least one side cemented to the side of the opaque layer not in contact with the surfaces of the three-dimensional substrate being photo-imaged. A pattern of grooves positioned on the opaque layer allow transmission of UV light during the photo-imaging of the surfaces of the three-dimensiional substrate. The pattern of grooves is in accordance with a conductive metal trace pattern desired on the surfaces of the three-dimensional printed circuit board substrate. The photo-mask is prepared by first forming an opaque material layer on the surfaces of the three-dimensional substrate, followed by a membrane material to form the membrane. The pattern of grooves is created by ablating the opaque layer in selected areas by means of a laser beam from a laser moved in a boustrophedonous manner.
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申请公布号 |
US5178976(A) |
申请公布日期 |
1993.01.12 |
申请号 |
US19900580058 |
申请日期 |
1990.09.10 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
ROSE, JAMES W.;KARAS, BRADLEY R.;ONYSHKEVYCH, LUBOMRY S. |
分类号 |
G03F1/14;H05K1/00;H05K3/00 |
主分类号 |
G03F1/14 |
代理机构 |
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地址 |
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