首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD OF PLATING SEMICONDUCTOR PACKAGE
摘要
申请公布号
JPH04369256(A)
申请公布日期
1992.12.22
申请号
JP19910144748
申请日期
1991.06.17
申请人
FUJITSU LTD
发明人
ISHIKAWA TAKESHI
分类号
C23C2/34;H01L23/50
主分类号
C23C2/34
代理机构
代理人
主权项
地址
您可能感兴趣的专利
LOAD CONTROLLING STRUCTURE OF WORKING VEHICLE
HIGHLY STABLE CURING AGENT FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION
POLYVINYL ALCOHOL-BASED FILM AND METHOD FOR PRODUCING THE POLYVINYL ALCOHOL-BASED FILM
LUBRICATING GREASE AND LUBRICATING GREASE-FILLED ROLLER BEARING
ANTI-FOGGING AGENT AND ANTI-FOGGING RESIN PRODUCT AND METHOD FOR PREVENTING FOGGING OF RESIN PRODUCT
HEAT-SHRINKABLE FILM
APPARATUS AND METHOD FOR FORMING VESSEL LID
MOLDING METHOD OF INTERIOR PART FOR VEHICLE
MOLD FOR OPTICAL PART
METAL JOINING METHOD
CONSUMABLE ELECTRODE TYPE ARC SPOT WELDING METHOD OF GALVANIZED STEEL SHEET
COMMUNICATION EQUIPMENT AND METHOD FOR IDENTIFYING COMMUNICATION EQUIPMENT
INTERCOM SYSTEM
INTERPHONE SYSTEM
COMMUNICATION TERMINAL DEVICE AND COMMUNICATION SYSTEM
DIGITAL BROADCAST VIDEO RECORDING AND REPRODUCING DEVICE
DATA TRANSMISSION DEVICE, DATA TRANSMISSION PROGRAM, DATA TRANSMISSION METHOD, AND DATA TRANSMISSION SYSTEM
