| 摘要 |
A packaging and cooling assembly for integrated circuit chips includes a base for reception of one or more circuit chips, and a combination heat sink and cover for attachment to the base. The circuit chips are mounted circuit side down on the base, and include flexible lead frames for attachment to bonding pads on the base. Compliant cushions that generally conform to the shape and size of the chips are held loosely between the circuit sides of the chips, and the base. The heat sink engages the back sides of the circuit chips when it is attached to the base. This causes the chips to compress the compliant cushions, thereby holding the chips firmly in position, and forming a high thermal conductivity interface between the chips and the heat sink. To further enhance the heat transfer characteristics of the interface, a thin film of fluid is coated on the back sides of each chip to fill in the microvoids which result from asperity contact of the heat sink and chip mating surfaces. A sealing gasket is provided between the heat sink and the base to form a protective enclosure for the chips. Intermediate housings or heat spreader structures may alternatively be disposed between the chips and the heat sink. |
