| 摘要 |
<p>PURPOSE:To stably obtain excellent characteristics of a semiconductor chip by arranging a heat sink on a front and/or rear surface of the chip. CONSTITUTION:A semiconductor device in which a semiconductor chip 2 formed with many contact pads and a wiring sheet in which leads 4 are previously formed on a front surface of an insulation film 3, are so laminated that the leads 4 are superposed on the contact pads of the chip 2 through a bump 5, thermally connected, and sealed with plastic 6, is provided.</p> |
