| 摘要 |
PURPOSE:To increase the concn. of photosensitive groups and to improve an exposing sensitivity by using an amide compd. which has excellent solubility in polyamic acid and contains carbon-carbon double bonds polymerizable by chemical rays as a solvent. CONSTITUTION:The photosensitive resin compsn. of the aminoacrylate compd. expressed by formula IV and a sensitizer having 330 to 53Onm absorption max. wavelength (lambdamax.) is dissolved into a polyamic acid soln. prepd. by using the amide compd. formed by bringing the arom. cliamine expressed by formula I, the silicone cliamine expressed by formula II and the arom. tetracarboxylic clianhydride expressed by formula III into reaction in the amide compd. contg. the carbon-carbon double bonds polymerizable by the chemical rays. This compsn. is applied on the surface of a semiconductor element and is exposed, developed and cured by heating, by which the semiconductor device is formed. In the formulas I to IV, R1, R2 denote hydrogen, alkyl group, etc.; R3 to R6 denote hydrogen, alkyl group, etc.; R7, R8 denote a bivalent org. group; R9, R10 denote a univalent org. group; R11 is expressed by formula V; X denotes-H,- CH3 group; Y denotes-CH3,-CH2CH3 group. |
