| 摘要 |
PURPOSE:To enable a measuring element to be optionally arranged on a chip by a method wherein the measuring element is connected to an unused pad provided onto the chip. CONSTITUTION:Common pads 2 connected to the inner leads 5 of a lead frame and exclusive pads 3 and 4 to be used according to packages are provided onto a semiconductor chip 1 capable of dealing with packages different in pin arrangement. As it is difficult to bond the inner leads 5 arranged in this manner to the dedicated pads 4 in view of assembly, the inner leads 5 are connected to the common pads 2 and the dedicated pads 3 with bonding wires 6. The common pads 2 are used for each lead frame in common. A measuring element 7 is arranged on the semiconductor chip 1 and connected to the unused dedicated pads 4 with a wiring 8 making the unused dedicated pad 4 serve as the pad of the element 7. By this setup, a measuring element can be optionally arranged on the chip 1. |
