| 摘要 |
PURPOSE:To enable the surface mounting and reflow soldering in a hybrid integrated circuit device using an organic substrate. CONSTITUTION:Through hole electrodes 2 are formed in one end of an organic substrate 1, and L-shape leads 3 are inserted for soldering to pinch the substrate 1 between the tips 4 of the L-shape leads 3 and U-shape parts 5 of the L-shape leads 3, and a tie-bar 6 is cut to realize external terminals of flat leads. |
