| 摘要 |
An electro-chemical etch device for selectively removing material from an electrically conductive surface. At least two electrodes are each at least partially immersed in an electrically conductive fluid and aligned across the surface, proximate to corresponding regions of the surface. A mechanism is provided to move the surface through the fluid, past the electrodes, transversely to the direction of alignment of the electrodes. A control mechanism electrically coupled between the electrodes and the surface controls electrical current flow into or out of the fluid at each of the electrodes. The conductive surface and the conductive fluid are selected such that the rate of material removal at any point on the conductive surface is substantially dependent upon the surface density of electrical current flow into or out of the fluid at that point.
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