发明名称 FABRICATION PROCESS FOR LOW LOSS METALLIZATIONS ON SUPERCONDUCTING THIN FILM DEVICES
摘要 <p>A method effectively produces patterned metal contacts (34) on a substrate (30) covered with a high temperature superconducting film (32) having good mechanical and electrical properties, especially adhesion and contact resistance, without degrading the microwave properties of the film. In the preferred embodiment, the superconducting film surface is cleaned by chemical etching, preferably with a dilute solution of bromine in methanol. Metal, preferably gold is deposited on the superconductor, preferably by sputtering. After the metal is deposited, it may be optionally patterned utilizing conventional lithographic techniques. Effective metallizations have been made on thallium-containing and YBCO superconductors. Devices result having good adhesion and contact resistance less than or equal to 5 x 10?-6 ohm cm2¿ at 77K. Subsequent annealing reduces contact resistance to less than 1 x 10?-8 ohm cm2¿.</p>
申请公布号 WO1992019786(A1) 申请公布日期 1992.11.12
申请号 US1992003827 申请日期 1992.05.08
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