发明名称 BONDING METHOD
摘要 <p>PURPOSE:To extremely enhance bonding strength without using an adhesive by a method wherein a hardly adhesive resin is brought into contact with a metal under pressure while melted to be held to the metal and subsequently cooled and solidified to form a bonded body of the resin and the metal. CONSTITUTION:In a bonding apparatus, a pair of rods 2 are erected on a stand 1 and an upper frame 3 is fixed to the upper parts of the respective rods 2 through nuts 4. A cylinder 12 having a heater 11 provided on the outer periphery thereof is provided between pistons 5, 10 and the end parts 5a, 10a of the pistons 5, 10 are inserted in the hole 12a of the cylinder 12 and upper and lower adherends 13, 14 composed of a metal are internally provided in the hole 12a. In a concrete bonding method, the adherends 13, 14 being round rods made of brass are prepared and bonded using a polytetrafluoroethylene resin 15. That is, the resin 15 is inserted in the gap between the upper and lower adherends 13, 14 to be heated under pressure and subsequently cooled to form a bonded body 20.</p>
申请公布号 JPH04296536(A) 申请公布日期 1992.10.20
申请号 JP19910062017 申请日期 1991.03.26
申请人 JAPAN STEEL WORKS LTD:THE;MINATO KIKUO 发明人 MIURA TAKESHI;MINATO KIKUO
分类号 B29C65/64;B29L9/00;C09J5/06 主分类号 B29C65/64
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