| 摘要 |
<p>PURPOSE:To eliminate heat dissipation of a lead connecting bonding tool of an electronic component and to prevent damage of a printed circuit substrate in a printed circuit substrate used widely for a circuit configuration of various types of electronic equipment. CONSTITUTION:In a multilayer printed substrate in which a pair of surface layers to become front and rear surfaces and a plurality of inner layers are laminated, a power source layer 12-2a in which an area for forming an electronic component connecting foot print 2-1a formed on the surface layer 2-1 and a conductor of a position corresponding to the area are removed, is provided on the inner layer 12-2.</p> |
