| 摘要 |
<p>A fluxless solder for application to metal surfaces which include contaminants such as metal oxides. The fluxless solder includes a reducing agent which reacts with interfering metal oxides to form essentially inert compounds which require no further cleaning. Reducing agents, such as lithium, calcium, strontium and cesium are disclosed for use in lead-tin solders, in amounts ranging from about 0,5 to 10 atom percent. Various methods for forming the fluxless solder are also disclosed.</p> |
