| 摘要 |
PURPOSE: To reduce a minimum needed enclosure by filling an opening part which runs in an insulating layer with metal, and performing etching until a metal plug is formed in the opening part. CONSTITUTION: An aluminum layer and an aluminum/heat-resisting metal alloy layer 32 are etched. The etching is carried out until the insulating layer 24 is exposed, and consequently the heat-resisting metal layer 28 is also removed considerably. Consequently, a plug of a metal consisting of the thin heat-resisting metal layer 28, and aluminum/heat-resisting metal alloy layer, i.e., 1st metal and a 1st layer area 32 is left in the opening part 26. Then, a heat-resisting metal layer, i.e., a 2nd metal layer 34 is left on the surface of the device. Consequently, the contact of the integrated circuit device which eliminates the need to provide a width-expanded part to a signal line of metal for securing an enclosure and its formation are obtained. |
