首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
HEAT SINK FOR SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH04208557(A)
申请公布日期
1992.07.30
申请号
JP19900340917
申请日期
1990.11.30
申请人
NEC CORP
发明人
YAMAMORI NOBUAKI
分类号
H01L23/373
主分类号
H01L23/373
代理机构
代理人
主权项
地址
您可能感兴趣的专利
PRODUCTION OF SELF TEMPERATURE COMPENSATION TYPE STRAIN GAGE
SILICONE SELF-ADHESIVE SHEET AND TAPE
MANUFACTURE OF ORGANOPOLYSILOXANE
GAALAS EPITAXIAL WAFER AND ITS PRODUCTION
PRODUCTION OF CHROMATIC HYDROUS TITANIUM OXIDE
METHOD FOR HUMIDIFYING GASEOUS HYDROGEN FOR REFORMING
INTERNAL GRINDER
METHOD FOR CONTROLLING PRESSURIZATION DIRECTION
UNDIRECTIONAL SOLIDIFYING FURNACE BY TEMPERATURE GRADIENT FURNACE
GLASS COMPOSITION FOR INSULATION AND COATING
PRESS
ALL POSITION AUTOMATIC ARC WELDING METHOD
PRODUCTION OF SLIDING MEMBER HAVING WEAR RESISTANCE
DIE CASTING METHOD
MANUFACTURE OF CLUTCH PISTON
MANUFACTURE OF ELLIPTICAL BELLOWS
MANUFACTURING DEVICE FOR SPIRAL PIPE
METHOD FOR FIXED RATE DISCHARGING OF ANAEROBIC LIQUID
PICTURE PROCESSING DEVICE
MANUFACTURE OF SEMICONDUCTOR DEVICE