| 摘要 |
<p>PURPOSE:To improve the heat radiation effect of the title device by shaping the surface of a sealing resin part into fin-shaped uneven configuration. CONSTITUTION:There are provided a lead 1, a sealing resin body 2a, and an uneven sealing resin heat radiation part 2b protruded, fin-shaped from the surface of the sealing resin body 2a. A semiconductor device is located in the sealing resin body 2a, and electrodes of the semiconductor device and the lead 1 are connected with each other through gold wires through which electric signals are delivered. The semiconductor device in the sealing resin body 2a is heated by electrical drive thereof, and most part of produced heat is transmitted to the sealing resin. Although heat radiation from the back surface of the sealing resin body 2a is limited, it is usually free for the surface side of the semiconductor device. Hereby, heat radiation effect is improved with ease and inexpensively.</p> |
