发明名称 HYBRID CIRCUIT DEVICE
摘要 PURPOSE:To constitute a hybrid circuit which allows high functional reliability by burying a terminal, which electrically connect a plurality of mounting circuit substrates, and a lead terminal, which connects the mounting circuit with the external part, in a resin enclosing wall. CONSTITUTION:A cylinder-shaped resin case main body 7, which is mounted integrally with a connector 4 and a terminal 8 at the positions facing each other, is prepared. As for the terminal 8, an element piece is formed by pressing, the broken lined parts which are parallel but not intersecting orthogonally with the element piece are bent so that the bent parallel planes are shifted from each other when seen from the vertical direction. The terminal 8 and the lead terminal 4 are arranged on a metal die and are cast using melt resin. Then, an Al heat releasing plate 1 is installed, mounting circuit substrates 2a and 2b are bonded on the both planes of the heat releasing plate 1 and the prescribed wiring is performed by wire bonding. Wiring is performed easily without a mistake from the both sides of the opening edge of the resin case.
申请公布号 JPH04196160(A) 申请公布日期 1992.07.15
申请号 JP19900321856 申请日期 1990.11.26
申请人 TOSHIBA CORP 发明人 IMAJI YOSHIAKI;TAGUCHI YASUO;HAYASHI TERUAKI
分类号 H01L25/00;H01L25/07;H01L25/18;H05K1/05;H05K1/14 主分类号 H01L25/00
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