| 摘要 |
<p>PURPOSE:To enable a centering mechanism to dispense with a device which relieves gate burrs by a method wherein a recess which is large enough to prevent gate burrs from protruding from the outer shape of a molded package is provided in the molded package. CONSTITUTION:The length (a) of a gate burr 3 induced at the removal of a gate is nearly equal to the thickness (b) of a part of the gate 2 in contact with a molded package. The length (c) of a recess provided to the molded package is set larger than the length 3a of the gate burr 3 by a length of 0.1-0.2mm or above, whereby a gate burr can be prevented from protruding out of the outer shape of the molded package. By this setup, a centering mechanism can dispense with a device which enables gate burrs to be relieved, and a semiconductor device where a shoot is not jammed can be obtained.</p> |
