<p>An automatic polishing system for polishing semiconductor material is described. A robot and Bernoulli pickup are used to retrieve polished wafers from an underwater unload station which is located on a wafer polisher. The polished wafer is then deposited into a cassette which is located underwater.</p>
申请公布号
EP0245289(B1)
申请公布日期
1992.05.27
申请号
EP19860905542
申请日期
1986.08.25
申请人
MOTOROLA, INC.
发明人
CRONKHITE, PAUL, W.;BOSLEY, BRUCE, C.;JONES, JAMES, H.;PATEL, ASIT, G.
