| 摘要 |
PURPOSE:To uniformly exert a pressure-contact force, to stabilize the operating characteristic of a semiconductor element and to enhance the reliability of a device by a method wherein a flexible insulating sheet is inserted between a metal base sheet and a pressure-contact electrode or between pressure-contact electrodes and the insulating sheet is fixed and bonded to members on the partner side by using an adhesive. CONSTITUTION:At a pressure-contact type semiconductor device, pressure-contact electrodes 3, 4 for external connection use are mounted side by side, via insulators, on a metal base sheet 2 on which semiconductor elements 1 have been mounted and the pressure-contact electrodes 3, 4 are wire-bonded to terminals of the semiconductor elements 1. At the semiconductor device, flexible insulating sheets 5, 6 as said insulators are inserted between the metal base sheet 2 and the pressure-contact electrode 3 or between the pressure-contact electrodes 3, 4, and the insulating sheets 5, 6 are fixed and bonded to members on the partner side by using an adhesive 7. For example, source and gate pressure-contact electrodes 3, 4 are mounted so as to be piled up collectively on the central part of a metal base sheet 2 on which a plurality of semiconductor elements 1 have been mounted so as to be dispersed, and insulating sheets 5, 6 by a polyester film, a polyimide film or the like are inserted between them via an adhesive 7. |
