发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable depression woking even in the case where the distance between an outer frame and an island end portion can not be ensured so as to be sufficient to contain a depression end portion in a resin seal region, by extending an island suspension lead toward the side of an island, and ensuring a region for depression on the side of the island. CONSTITUTION:Bent parts 15a, 16a, 17a are formed on island suspension leads 15, 16, 17, respectively, as the result of depression of an island 3, and correspond to depression end portions. The island suspension leads 15, 16, 17 are extended toward the side part of the island 3, and the region for the depression end portions is ensured on the side of the island 3. By using this lead frame, depression working is enabled even in the case where the distances between outer frames 1, 2 and the island 3 end portions can not be ensured so as to be sufficient to contain the depression end portions in a resin seal region, on account of the size of a chip 6.
申请公布号 JPH04137553(A) 申请公布日期 1992.05.12
申请号 JP19900258618 申请日期 1990.09.27
申请人 TOSHIBA CORP 发明人 HAYASHI KAZUNORI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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