发明名称 METHOD AND APPARATUS FOR SPATIALLY UNIFORM ELECTROPOLISHING AND ELECTROLYTIC ETCHING
摘要 <p>In an electropolishing or electrolytic etching apparatus the anode (14) is separated from the cathode (32) to prevent bubble transport to the anode and to produce a uniform current distribution at the anode by means of a solid nonconducting anode-cathode barrier (28). The anode extends into the top of the barrier and the cathode is outside the barrier. A virtual cathode hole (30) formed in the bottom of the barrier below the level of the cathode permits current flow while preventing bubble transport. The anode is rotatable an oriented horizontally facing down. An extended anode is formed by mounting the workpiece in a holder (16) which extends the electropolishing or etching area beyond the edge of the workpiece to reduce edge effects at the workpiece. Endpoint detection and current shut-off stop polishing. Spatially uniform polishing or etching can be rapidly performed.</p>
申请公布号 WO1992007118(A1) 申请公布日期 1992.04.30
申请号 US1991007515 申请日期 1991.10.11
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