| 摘要 |
<p>Method for putting a substrate (9) fitted with a printed circuit and with its components into a sealed encapsulation, the plastic encapsulation consisting of two parts (1, 2) welded together by ultrasound. One of the parts (1) of the encapsulation is equipped with means for support (5) and lateral retention (16) of the substrate (9). The other part (2) is equipped with projections (10) the distance d of which before welding is substantially equal to the weld height h1 and less than the height h2 measured between the level of the support means (5) of the substrate and the upper edge of the lateral retention (16), a lateral play e is moreover provided for between the substrate and the part of the encapsulation which supports it. During the ultrasound welding, the upper part (2) of the encapsulation descends and the application of ultrasounds is interrupted when the projections (10) come into contact with the substrate. At that point, the welding is carried out without the substrate having been subjected to vibrations. <IMAGE></p> |
