发明名称 RESIN MATERIAL FOR LEAD FRAME INSERT AND MOLDING FORM THEREOF
摘要 <p>PURPOSE:To remarkably improve adhesive properties with a lead frame without reducing mechanical properties without almost generating decomposed gas or deposited gas with high thermal stability by mixing polyarylene sulfide resin as a main ingredient, alpha-olefin copolymer graft-copolymerized with unsaturated carboxylic acid or its anhydride, and inorganic filler at a special ratio. CONSTITUTION:0.1-30 pts.wt. of alpha-olefin copolymer graft-polymerized with unsaturated carboxylic acid or its anhydride and 10-300 pts.wt. of fibrous filler, nonfibrous inorganic filler or mixture of both are mixed with 100 pts.wt. of polyarylene sulfide resin. The resin is not particularly limited, polymer of oxide crosslinking or thermal crosslinking may be used, and desirably polymer of substantially linear molecular structure having low crosslinking degree obtained by condensation polymerization from bifunctional monomer may be used. It is particularly desirable to use unsaturated carboxylic acid or its anhydride of maleic acid anhydride having 1.0-5.0% of graft rate.</p>
申请公布号 JPH04123461(A) 申请公布日期 1992.04.23
申请号 JP19900405984 申请日期 1990.12.25
申请人 POLYPLASTICS CO 发明人 NAKAI MIKIO
分类号 C08K3/34;C08K7/14;C08L81/02;H01L23/29;H01L23/31 主分类号 C08K3/34
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