| 摘要 |
<p>A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a high percentage of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5 % of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06 % by weight of the antimony pentoxide, a lower percent of antimony pentoxyde, preferably in the range of less than or about 0.8 % by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0 % by weight of the molding compound. The flame retardant epoxy molding compounds when used to encapsulated semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.</p> |
