| 摘要 |
PURPOSE:To improve antioxidation without loss of adhesion strength and heat resistance of the adhering surface of an inner layer copper of a board by processing the circuit copper surface of an inner layer circuit board with copper oxide or cuprous oxide, and then dipping it in chromium compound solution. CONSTITUTION:In manufacture of superposing copper foils, one side or both-side copper-plated laminated boards on one or more inner layer circuit boards formed on one or both side surfaces with circuit patterns through prepregs, heating, pressuring and integrating the layer, the circuit copper foil surfaces of the inner layer circuit board is processed with copper oxide or cuprous oxide, and then dipped in solution of 0.01-10% of chromium compound in concentration, in which ammonium chromate is dissolved with solvent such as water, alcohol. When it is surface treated with the chromium compound, a chromate film having antioxidation can be formed while maintaining roughed state by copper oxidation. Accordingly, excellent antioxidation, adhesive strength and solder heat resistance equivalent to those of copper oxidation are provided. |
