发明名称 |
CUTTING DEVICE FOR ADJUSTMENT OF RESONANCE FREQUENCY OF DIELECTRIC RESONATOR |
摘要 |
PURPOSE:To attain a quick and highly accurate cutting process for a dielectric resonator by controlling the position of a cutting blade or a stage based on the detection signal of a vibration sensor so as to enable the cutting blade to cut the ground surface of a dielectric substance of the dielectric resonator in the prescribed depth. CONSTITUTION:A vibration sensor 9 detects the ultrasonic vibrations and sends a detection signal to a controller 10. The controller 10 receives the detection signal and knows the time point when the tip of a cutting blade 6 reaches the ground surface of a dielectric substance. Based on this time point, the controller 10 controls the position of the blade 6 or a stage 8 in order to cut the surface of the dielectric substance in the prescribed depth. Then the blade 6 or the stage 8 is laterally moved by a prescribed distance to delete the prescribed number of electrodes. Thus the dielectric substance can be cut in a prescribed amount with high accuracy. Then the adjusting accuracy is improved for the resonance frequency of a dielectric resonator. |
申请公布号 |
JPH0492503(A) |
申请公布日期 |
1992.03.25 |
申请号 |
JP19900208271 |
申请日期 |
1990.08.08 |
申请人 |
OKI ELECTRIC IND CO LTD |
发明人 |
HORIGUCHI FUJIO;BABA TAKAHISA;MIYAMOTO ATSUSHI |
分类号 |
H01P1/205;H01P7/04;H01P11/00 |
主分类号 |
H01P1/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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