| 摘要 |
<p>PURPOSE:To enable a circuit board to be improved in mounting density and miniaturized by a method wherein a resistor is formed in a through-hole provided to a board or in a viahole provided to an insulating layer formed on the board. CONSTITUTION:A through-hole 4 is provided to an alumina board 1, and a thick-film resistor paste 2 is filled into the through-hole 4 and dried up. The board 1 is burned after drying into a circuit board, a conductor 3 is printed on the rear side of the circuit board to connect all the resistors in the through- holes 4 together and dried up. As mentioned above, a resistor is provided to the through-holes 4 and/or viaholes 5, whereby an area occupied by a large number of thick film resistors which are obstacles to mounting of high density on the surface of a circuit board can be lessened, therefore not only a circuit board can be improved in mounting and wiring density but also an electronic equipment can be miniaturized.</p> |
