| 摘要 |
PURPOSE:To enable a connecting pad having a width much larger than the width of the line of a strip line circuit to be connected rapidly and easily to the outside with good impedance matching, by providing the pad on an aperture formed in a grounding surface while superposing the periphery of the pad on the grounding surface. CONSTITUTION:Connecting pads 1 are provided on the grounding surfaces of a substrate 5 and of a chip 8 through insulators 4, and are connected with each other by a solder bumper 2. An aperture 9 is provided in the grounding surface. The pad 1 is attached so as to cover this aperture 9, and the periphery of the pad is superposed on the grounding surface 3 with the insulator 4 interposed therebetween. By providing the pad 1 and the grounding surface in such relation, the pad can be connected to a strip line circuit on a chip or card with good impedance matching. |
