| 摘要 |
PURPOSE:To easily and reliably prevent a wire lead from sagging down by providing a level difference at the front end of an inner lead. CONSTITUTION:By passing, for example, an Au line 6 through a capillary 21 and using a hydrogen torch, etc., an Au ball 22 is formed at the front end of the Au wire 6. Then, after the Au ball 22 is attached to the bonding pad of a semiconductor element on a die pad by thermocompression, the capillary 21 is moved onto an inner lead 5. When the capillary 21 is moved onto the lead 5, the Au wire 6 is stretched from the semiconductor chip to the inner lead 5 side. Then the capillary 21 is lowered and, at the same time, the Au wire 6 is press-contacted with the inner lead 5 while heat and weight are added to the capillary 21 and the capillary 21 is vibrated with ultrasonic waves. Thereafter, after the Au wire 6 is clamped, the capillary 21 is moved obliquely upward so as to cut the wire 6. At the time of cutting the Au wire 6, sagging of the wire 6 can be prevented, because a level difference 12 provided at the front end of the inner lead 5 supports the wire 6. |
