RESIN SEALED TYPE SEMICONDUCTOR PACKAGE

摘要

PURPOSE:To enable high density mounting by bending down an outer lead to bring it into contact with the side of a semiconductor package at the point where the lead is projected from the side and not allowing the edge of the lead to be projected from the bottom surface of the semiconductor package. CONSTITUTION:An outer lead 5 projected from a resin 1 is bent rectangularly at the point where the lead is projected from the resin to be brought into contact with the lower side 6 of a semiconductor package and the edge of the lead is made to reach the same plane of the bottom surface 7 of the semiconductor package. The upper side 8 of the semiconductor package has the difference of a step nearly equal to the thickness of the outer lead 5. The side of the semiconductor package is divided into two, an upper side 8 and a lower side 6, and the upper side 8 and the side of the outer lead 5 bent down and brought into contact with the lower side 6 are nearly on the same plane.