| 摘要 |
PURPOSE:To make a package small in size and to improve a semiconductor device in mounting density by a method wherein lead frames are so laminated as to be insulated from each other, and the semiconductor device is wired in multilayer. CONSTITUTION:High melting point glass 6 is applied onto the upside and the underside of a ceramic board 5, and a first lead frame 2a and a second lead frame 2b are fixed to constitute a multilayered wiring board B. The first lead frames 2a and the second lead frames 2b are provided zigzag so as not to overlap each other and bent downward at a right angle. The multilayered wiring board B is fixed to the peripheral edge of a ceramic board l with a low melting point glass 3, a semiconductor element 7 is mounted on the center of the board 1, and the semiconductor element 7 and the lead frames 2a and 2b are electrically connected together with bonding wires 8. A ceramic cap 4 is bonded to the upside of the multilayer wiring board B with a low melting point glass 3, and the semiconductor element 7 and the joint between the element 7 and the lead frames 2a and 2b are hermetically sealed up.
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